At Auto Shanghai, Intel introduced its second-generation AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC), the industry’s first to use a multi-process node chiplet architecture. This new SoC offers scalable performance, advanced AI, and cost efficiency for intelligent, connected vehicles.
Intel also announced partnerships with ModelBest and Black Sesame Technologies to accelerate innovation in AI-powered cockpits, ADAS, and energy-efficient platforms. Key improvements include up to 10x better AI performance, 3x better graphics, and support for 12 camera lanes.
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